Design and Analysis of High-Density Silicon Interposer Channel and Power Distribution Network

This paper presents a design guide for silicon inter-poser channels and power distribution networks (PDN) in post-HBM3 high-density 1/0 implementations. We introduce a novel reference-paired shielding (RPS) scheme that mitigates crosstalk and reduces metal layer count. Our optimal RPS pattern, which takes into account crosstalk, simultaneous switching noise (SSN), and redistribution layer effects, achieves a maximum datarate of 7.1 Gbps for high-density 1/0 implementation. This represents a 31.5% improvement over conventional interposer channels while using one fewer metal layer. We also analyze the trade-off between 1/0 channel and PDN allocation within a limited interposer area, examining crosstalk and SSN effects relative to channel dimensions and PDN area.