Cascading of 2D and 3D Simulations of ASIC Substrate Interconnect up to 100 GHz
A method of cascading 3D models and 2D models to model the full channel of ASIC package substrate interconnects is proposed, showing good match to full-wave results in S-parameter and TDR up to 100 GHz.
Authors
- Srinivas Venkataraman
- Zhekun Peng (ORCID: https://orcid.org/0000-0002-0722-8097)
- Santosh Pappu
- Xu Wang (ORCID: https://orcid.org/0000-0001-5114-4897)
- DongHyun Kim (ORCID: https://orcid.org/0000-0003-2738-9549)
- Junyong Park (ORCID: https://orcid.org/0000-0002-5446-1799)
- Sathvika Bandi
- Granthana Ranzaswamy
Institutions
- Missouri University of Science and Technology (US)
- Meta (United States) (US)
Publication Details
- Published
- 2024-10-06
- DOI
- https://doi.org/10.1109/epeps61853.2024.10754397
- Citations
- 1
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21