High performance detector and FEE combined solutions for visible and infrared imaging to support future space missions

As the imaging devices increase in complexity so the development of electronic to interface those detectors due to their high level of flexibility and programmability. Referred to as Front End Electronics (FEE) it is often the bottleneck in new developments. It became clear that developing the FEE platform solution along aside the detector gave a critical advantage to the mission development time and therefore cost. Also providing a solution including FEE that can interface with the rest of the payload/instrument without further integration work reduces the integration time and cost. This is an area where Teledyne-e2v has worked and invested to develop an effective FEE platform solution for a range of imaging detectors from VUV to IR. In order to supply effective imaging solutions, it is clear it is critical to keep investing in developing state-of-the-art detectors but also to combine those detectors with FEE to interface those complex detectors and ease further their integration at instrument level. The presentation will cover innovations at Teledyne-e2v in both detector and FEE areas.