Feasibility Analysis of Parameter-Based Temperature Estimation of pGaN Power HEMTs Under Consideration of Charge Carrier Trapping

In this paper, several typical temperature sensitive electrical parameters are investigated regarding their applicability in Schottky-contact and Gate-Injection GaN HEMTs. In addition, the effect of charge carrier trapping on the temperature behavior of the threshold voltage and gate current is analyzed. It is found that the drain-source on-resistance, the drain-source capacitance, and the transconductance can all be exploited for temperature estimation. On the other hand, shifting of the threshold voltage due to gate voltage stresses obfuscates any shifting caused by temperature changes in Schottky-contact device and the ohmic-contact device to a smaller degree. The gate current of the Schottky-contact device is also stress-dependent around the threshold voltage, but stabilizes at higher gate-source voltage values. In contrast, the gate current of the ohmic-contact device is unaffected by gate stress in the transistor on-state.

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Publication Details

Published
2024-09-02
DOI
https://doi.org/10.1109/ecceeurope62508.2024.10751925
Citations
2
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.62

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article

Feasibility Analysis of Parameter-Based Temperature Estimation of pGaN Power HEMTs Under Consideration of Charge Carrier Trapping

Martin Pfost, Jorge Pérez
2 citations
GaN-based semiconductor devices and materials
0.62
article

Feasibility Analysis of Parameter-Based Temperature Estimation of pGaN Power HEMTs Under Consideration of Charge Carrier Trapping

Martin Pfost, Jorge Pérez
article en
2 citations

Abstract

In this paper, several typical temperature sensitive electrical parameters are investigated regarding their applicability in Schottky-contact and Gate-Injection GaN HEMTs. In addition, the effect of charge carrier trapping on the temperature behavior of the threshold voltage and gate current is analyzed. It is found that the drain-source on-resistance, the drain-source capacitance, and the transconductance can all be exploited for temperature estimation. On the other hand, shifting of the threshold voltage due to gate voltage stresses obfuscates any shifting caused by temperature changes in Schottky-contact device and the ohmic-contact device to a smaller degree. The gate current of the Schottky-contact device is also stress-dependent around the threshold voltage, but stabilizes at higher gate-source voltage values. In contrast, the gate current of the ohmic-contact device is unaffected by gate stress in the transistor on-state.

TU Dortmund University (DE), ZF Friedrichshafen (Germany) (DE)
Ministry of Education
Affordable and clean energy
Openalex Percentile: Top 32%
GaN-based semiconductor devices and materials
0.62
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