Procedure for switching loss determination in an oscillatory environment of GaN FETs in a half-bridge connection

This paper presents a circuit-level analysis aimed at a rapid switching loss determination in a half-bridge connection utilizing Gallium-nitride field-effect transistors (GaN FETs) in the presence of parasitic elements. A thorough investigation is carried out into the mechanism of oscillations in the gate loop and commmutation loop and a procedure to reduce the current decline during the freewheeling state is presented. Simulation results are provided to demonstrate and validate circuit-level analysis graphically. It is revealed that gate loop oscillations show dependency on the commutation loop due to common source inductance and Miller capacitance. A larger gate resistance could damp oscillations fast but possibly increase the peak value, leading to gate breakdown. Additionally, a power loss analysis of GaN FETs in reverse conduction status reveals a reduction in losses compared to conventional double pulse test (DPT) methods, further steadying the load current and favoring switching loss measurement of GaN FETs at the same level.

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Published
2024-09-02
DOI
https://doi.org/10.1109/ecceeurope62508.2024.10751993
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
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article

Procedure for switching loss determination in an oscillatory environment of GaN FETs in a half-bridge connection

Christian Fager, Torbjörn Thiringer, Pengpeng Sun
1 citations
GaN-based semiconductor devices and materials
0.31
article

Procedure for switching loss determination in an oscillatory environment of GaN FETs in a half-bridge connection

Christian Fager, Torbjörn Thiringer, Pengpeng Sun
article en
1 citations

Abstract

This paper presents a circuit-level analysis aimed at a rapid switching loss determination in a half-bridge connection utilizing Gallium-nitride field-effect transistors (GaN FETs) in the presence of parasitic elements. A thorough investigation is carried out into the mechanism of oscillations in the gate loop and commmutation loop and a procedure to reduce the current decline during the freewheeling state is presented. Simulation results are provided to demonstrate and validate circuit-level analysis graphically. It is revealed that gate loop oscillations show dependency on the commutation loop due to common source inductance and Miller capacitance. A larger gate resistance could damp oscillations fast but possibly increase the peak value, leading to gate breakdown. Additionally, a power loss analysis of GaN FETs in reverse conduction status reveals a reduction in losses compared to conventional double pulse test (DPT) methods, further steadying the load current and favoring switching loss measurement of GaN FETs at the same level.

Nanosc (Sweden) (SE), Chalmers University of Technology (SE)
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GaN-based semiconductor devices and materials
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