Finar Buffer as a technology platform for HVDC and FACT application

Power electronic devices for high-voltage direct current (HVDC) and flexible AC transmission systems (FATCS) including IGBTs and thyristors, have several requirements for reliability, short-circuit failure mode, high thermal mass, large current ratings, mechanical protection, and mechanical robustness. Finar Buffer (FB) is a compliant structure, eventually directly integrated into the electrode material, which offers unique mechanical capabilities. These allow to develop a packaging technology platform around a compliant low-pressure, high-reliability attach-based joint between electrodes and the semiconductor, including large area devices, extreme thickness tolerance, large manufacturing and roughness tolerance, and outstanding electrical and thermal conductivity.