Review of Methods for Determination of Ageing and Remaining Lifetime for Power Modules

Power modules are key to the operation of power electronic systems, affecting their reliability and efficiency. This paper compares various methods for evaluating the ageing and estimating the remaining life of these modules. Special attention is given to common failures like bond wire cracks, chip solder degradation, DCB substrate issues, and baseplate solder problems. By examining these failures, the paper aims to highlight how different assessment techniques perform in detecting early signs of damage and their effectiveness in predicting remaining lifetime. The findings intend to guide engineers in choosing the right tools and approaches for maintaining the health of power modules, ultimately improving the durability and performance of power electronic systems.