Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules

This study investigates the potential of novel large-area sintered silver pastes for establishing highly reliable interconnections between baseplates and metallic ceramic substrates such as Direct Copper Bonded (DCB) or Active Metal Brazed (AMB). The evaluation of advanced AMB substrates (Condura®.prime) and cost-effective counterpart Condura®.ultra (AMB2.0) reveals their resilience after 3000 thermal cycles, with AMB2.0 demonstrating comparable Temperature Shock Test (TST) performance to the standard AMB. The study also highlights the potential for sintered attachments to outlast conventional soldered connections by up to 30 times, positioning the sintered paste as a viable choice for highly reliable baseplate attachment applications. Moreover, the research identifies the impact of copper layer thickness and sintering parameters on reliability, while also noting the comparative reliability challenges associated with aluminum baseplates. The findings underscore the importance of considering both paste-related factors and intrinsic device characteristics when transitioning to sintered baseplate attachments to optimize reliability in specific applications. This research provides valuable insights for the advancement of interconnection technologies in metallic ceramic substrates.