Stack integration structure of multiple high-frequency magnetic devices for power applications
In recent years, driven by advancements in the information society, achieving high power density has emerged as a crucial objective for power supply facilities across data centers and factories. The magnetic devices employed in AC-DC converters, comprising Power Factor Correction (PFC) circuits and LLC converters, are fundamental in numerous power supply setups. Traditionally, the integration of magnetic devices has been advocated to reduce the footprint of power supply circuits. However, integrated magnetic devices operating in multiple circuit configurations, including PFC circuits and LLC converters, often introduce mutual interference among the magnetic devices, consequently impeding circuit functionality. In this paper, we propose an enhanced winding structure for inductors and a stacked configuration where all magnetic devices are vertically integrated. Our experimental findings showcase that mutual interference between each magnetic device can be effectively suppressed, thereby highlighting the potential for miniaturization gains.
Authors
- Eiji Hiraki (ORCID: https://orcid.org/0000-0001-5896-2366)
- Kazuhiro Umetani (ORCID: https://orcid.org/0000-0002-3983-1931)
- Masataka Ishihara (ORCID: https://orcid.org/0000-0002-9388-6001)
- Daichi Buto
- Tomohide Sirakawa
Institutions
- Okayama University (JP)
- National Institute of Technology, Ariake College (JP)
Publication Details
- Published
- 2024-09-02
- DOI
- https://doi.org/10.1109/ecceeurope62508.2024.10752048
- Citations
- 1
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.21