Characterizing Interconnects to 325 GHz
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line (mTRL) calibration and subsequently de-embeds the interconnect with a multitiered calibration. We experimentally validated our method to 325 GHz with distributed contactless interconnects in the form of broadside coupled coplanar waveguides (CPWs) as a test case. We find excellent agreement between experimental, full-wave simulations, and a distributed model of contactless interconnects. This work provides a general method to accurately characterize interconnects and to translate measurement reference planes beyond interconnect boundaries when one or more interconnect ports are not directly accessible.
Authors
- Nathan D. Orloff (ORCID: https://orcid.org/0000-0001-5391-4699)
- Jérôme Chéron (ORCID: https://orcid.org/0000-0002-1423-7725)
- Christian J. Long (ORCID: https://orcid.org/0000-0002-4927-7209)
- Eric J. Marksz (ORCID: https://orcid.org/0000-0003-4470-0175)
- Aaron M. Hagerstrom (ORCID: https://orcid.org/0000-0003-4675-4636)
- Bryan T. Bosworth (ORCID: https://orcid.org/0000-0002-3844-3312)
- F. Bergmann (ORCID: https://orcid.org/0000-0003-3201-8662)
- Dylan F. Williams (ORCID: https://orcid.org/0000-0002-8271-1505)
- Meagan Papac (ORCID: https://orcid.org/0000-0003-1203-8615)
- Nicholas R. Jungwirth (ORCID: https://orcid.org/0000-0001-5995-1220)
- Angela C. Stelson (ORCID: https://orcid.org/0000-0002-8900-140X)
- A. Feldman (ORCID: https://orcid.org/0000-0002-9603-4031)
Institutions
- National Institute of Standards and Technology (US)
Publication Details
- Journal
- IEEE Transactions on Microwave Theory and Techniques
- Published
- 2024-11-20
- DOI
- https://doi.org/10.1109/tmtt.2024.3496657
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Defense Advanced Research Projects Agency