Buckling Behavior Analysis of Kirigami Structure Under Tension

Flexible electronic technology has attracted great interest, where rigid and brittle semiconductor materials can withstand large deformation. In order to improve the stretchability of devices, many novel structures have been designed, such as the classical "wavy" structure, the island-bridge structure, and origami structures that achieve stretchability through creases. However, the stretchability of these structures is still not large enough. Inspired by traditional kirigami, the stretchability of devices is achieved by making various periodic cuts in the substrate while the devices are placed in the area around the cuts. The previous research mainly focused on the change in the electrical properties of the structure during the deformation process, and there were few studies on the mechanical mechanisms. Therefore, this paper studies the buckling behavior of the kirigami structure when the substrate is stretched, and its mechanism can provide guidance for practical applications.