Reduction of the residual warpage of fused deposition modeling by negative thermal expansion filler

We investigated the suppression of residual warpage using a negative thermal expansion (NTE) material filler, Zn 1.6 Mg 0.4 P 2 O 7 . To focus on the effect of thermal expansion on residual warpage, we used acrylonitrile-butadiene-styrene, which is an amorphous polymer with a small volume change around the liquid–solid phase transition, as the matrix. Composite pellets were prepared using a kneader, and filaments were produced for fused deposition modeling (FDM) using an extruder. We fabricated a bar-like test piece using a standard FDM machine and measured the warpage deformation using 3D scanning. The experimental results were supported by the finite element method. We also compared similarly sized SiO 2 powders to discuss the advantages of NTE over conventional fillers. The warpage of a 100 mm x 5 mm x 2 mm bar-like test piece was reduced by approximately 75% by introducing Zn 1.6 Mg 0.4 P 2 O 7 at 40 vol%. The effect of Zn 1.6 Mg 0.4 P 2 O 7 at 30 vol% is similar to that of a conventional SiO 2 filler at 40 vol%. Reducing the residual deformation through fillers would reduce energy consumption and simplify the device by avoiding build stage and chamber heating. • Introducing a negative thermal expansion filler to suppress the residual warpage of fused deposition modeling. • The negative thermal expansion material used is Zn 1.6 Mg 0.4 P 2 O 7 . • Warpage of fabricated test pieces was measured and analyzed using 3D scanning and finite element method. • Introducing 40 vol% Zn 1.6 Mg 0.4 P 2 O 7 reduced warpage by approximately 75%. • Zn 1.6 Mg 0.4 P 2 O 7 at 30 vol% showed similar effect to 40 vol% conventional SiO 2 filler.

Authors

Institutions

Publication Details

Journal
Materials & Design
Published
2024-11-20
DOI
https://doi.org/10.1016/j.matdes.2024.113472
Citations
3
Primary Topic
Thermal Expansion and Ionic Conductivity
Type
article
Field-Weighted Citation Impact
0.35

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Reduction of the residual warpage of fused deposition modeling by negative thermal expansion filler

Akihiro Takezawa, Minoru Kawaguchi, Masahiro Sakagami, Saito Ishiue
3 citations
Materials & Design
Thermal Expansion and Ionic Conductivity
0.35
article

Reduction of the residual warpage of fused deposition modeling by negative thermal expansion filler

Akihiro Takezawa, Minoru Kawaguchi, Masahiro Sakagami, Saito Ishiue
article en
3 citations

Abstract

We investigated the suppression of residual warpage using a negative thermal expansion (NTE) material filler, Zn 1.6 Mg 0.4 P 2 O 7 . To focus on the effect of thermal expansion on residual warpage, we used acrylonitrile-butadiene-styrene, which is an amorphous polymer with a small volume change around the liquid–solid phase transition, as the matrix. Composite pellets were prepared using a kneader, and filaments were produced for fused deposition modeling (FDM) using an extruder. We fabricated a bar-like test piece using a standard FDM machine and measured the warpage deformation using 3D scanning. The experimental results were supported by the finite element method. We also compared similarly sized SiO 2 powders to discuss the advantages of NTE over conventional fillers. The warpage of a 100 mm x 5 mm x 2 mm bar-like test piece was reduced by approximately 75% by introducing Zn 1.6 Mg 0.4 P 2 O 7 at 40 vol%. The effect of Zn 1.6 Mg 0.4 P 2 O 7 at 30 vol% is similar to that of a conventional SiO 2 filler at 40 vol%. Reducing the residual deformation through fillers would reduce energy consumption and simplify the device by avoiding build stage and chamber heating. • Introducing a negative thermal expansion filler to suppress the residual warpage of fused deposition modeling. • The negative thermal expansion material used is Zn 1.6 Mg 0.4 P 2 O 7 . • Warpage of fabricated test pieces was measured and analyzed using 3D scanning and finite element method. • Introducing 40 vol% Zn 1.6 Mg 0.4 P 2 O 7 reduced warpage by approximately 75%. • Zn 1.6 Mg 0.4 P 2 O 7 at 30 vol% showed similar effect to 40 vol% conventional SiO 2 filler.

Materials & DesignVol. 248
Waseda University (JP)
Japan Society for the Promotion of Science
Climate action
Openalex Percentile: Top 43%
Thermal Expansion and Ionic Conductivity
0.35
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Reduction of the residual warpage of fused deposition modeling by negative thermal expansion filler — Akihiro Takezawa, Minoru Kawaguchi, et al. · Materials & Design (2024) | TGRS Research Map | TGRS