On Prognosis of Manufacturing of P-N-Heterojunctions in the Framework of a Multilevel Inverter with Reduced Number of Switches to Increase Their Integration Rate. On Influence Mismatch-Induced Stress

In this paper we introduce an approach to increase density of p-n-heterojunctions in the framework of a multilevel inverter with reduced number of switches. Framework the approach we consider manufacturing the inverter in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed in the framework od an optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.

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Publication Details

Journal
Circuits and Systems An International Journal
Published
2024-10-28
DOI
https://doi.org/10.5121/csij.2024.11401
Primary Topic
Electric Power Systems and Control
Type
article
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article

On Prognosis of Manufacturing of P-N-Heterojunctions in the Framework of a Multilevel Inverter with Reduced Number of Switches to Increase Their Integration Rate. On Influence Mismatch-Induced Stress

E. L. Pankratov
Circuits and Systems An International Journal
Electric Power Systems and Control
article

On Prognosis of Manufacturing of P-N-Heterojunctions in the Framework of a Multilevel Inverter with Reduced Number of Switches to Increase Their Integration Rate. On Influence Mismatch-Induced Stress

E. L. Pankratov
article en

Abstract

In this paper we introduce an approach to increase density of p-n-heterojunctions in the framework of a multilevel inverter with reduced number of switches. Framework the approach we consider manufacturing the inverter in heterostructure with specific configuration. Several required areas of the heterostructure should be doped by diffusion or ion implantation. After that dopant and radiation defects should by annealed in the framework od an optimized scheme. We also consider an approach to decrease value of mismatch-induced stress in the considered heterostructure. We introduce an analytical approach to analyze mass and heat transport in heterostructures during manufacturing of integrated circuits with account mismatch-induced stress.

Circuits and Systems An International JournalVol. 11(2/3/4)
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Electric Power Systems and Control
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