Hybrid package integration strategy for silicon ICs operating beyond 200 GHz

Abstract This paper proposes an innovative hybrid package integration strategy compatible with silicon-based technologies. It is evaluated beyond 200 GHz by the integration of a WR3 back-to-back waveguide-to-suspended stripline transition designed in BiCMOS technology, relying on metallic split-block package and organic laminate substrate. Simulated insertion loss below 3 dB is observed in the 220–320 GHz frequency band, competing with reported traditional solutions using III–V substrates. The achieved performances lead to promising perspectives for low-cost silicon packaging solutions beyond 200 GHz.