A 200-GHz Phased-Array Wireless Communication System Using HTCC System-in-Package Technology

This article presents a 200-GHz phased-array wireless communication system featuring local oscillator beamforming using high-temperature cofired ceramic (HTCC) technology. The system is constructed using HTCC transmit (Tx) and receive (Rx) system-in-packages (SiPs), which are mounted on printed circuit boards and connected to parabolic antennas through waveguide feeders. These SiPs heterogeneously integrate all components of the front-end channels, achieving low-loss interconnection and 3-D integration through vertical hollow waveguides within the HTCC. The Tx SiPs incorporate integrated Schottky diode mixers with MoCu waveguide filters, performing single-sideband upconversion with high image rejection. Measured Tx channel gain ranges from 17 to 40 dB over 192.5 to 212.5 GHz, with channel saturated output power from 5.2 to 9.6 dBm over 193.5 to 211.5 GHz. Furthermore, the eight-element Tx array achieves an effective isotropic radiated power of 35.9–43.3 dBm across 196–213 GHz and supports a scanning capability of ±30° in the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">E</i>-plane. The phased-array Tx-Rx wireless link is demonstrated over a 30-m distance using 16-quadrature amplitude modulation (QAM) and 64-QAM waveforms, supporting maximum data rates of 32 and 24 Gbps, respectively.