SRAM With Oxide Semiconductor Pull-Down Transistors on the Backside Enabling Full-Node PPA Improvement

The 6T SRAM bitcell, consisting of four pFETs on the same tier and two oxide-semiconductor pull-down transistors stacked on the backside, can achieve 17% power reduction, 32% performance enhancement, and 42% area reduction as compared to one-tier SRAM bitcell. With the high strength ratio of the pass-gate transistors to the pull-down transistors, near-threshold-voltage write reduces the minimum operating voltage.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2024-11-15
DOI
https://doi.org/10.1109/led.2024.3498840
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00

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article

SRAM With Oxide Semiconductor Pull-Down Transistors on the Backside Enabling Full-Node PPA Improvement

Hsin-Cheng Lin, Tien‐Chen Liu, Tao Chou, C. W. Liu et al.
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SRAM With Oxide Semiconductor Pull-Down Transistors on the Backside Enabling Full-Node PPA Improvement

Hsin-Cheng Lin, Tien‐Chen Liu, Tao Chou, C. W. Liu, Li-Kai Wang, Ching-Wang Yao, Tsai-Yu Chung
article en

Abstract

The 6T SRAM bitcell, consisting of four pFETs on the same tier and two oxide-semiconductor pull-down transistors stacked on the backside, can achieve 17% power reduction, 32% performance enhancement, and 42% area reduction as compared to one-tier SRAM bitcell. With the high strength ratio of the pass-gate transistors to the pull-down transistors, near-threshold-voltage write reduces the minimum operating voltage.

IEEE Electron Device LettersVol. 46(1)
National Taiwan University (TW)
National Science and Technology Council
Affordable and clean energy
Openalex Percentile: Top 82%
Semiconductor materials and devices
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