Protective Ni composite film on Cu prepared by inverse-replacement reaction

Abstract In high concentrated thiourea solution, Ni composite film was directly deposited onto Cu via inverse-replacement reaction of Ni 2+ by Cu. Significantly, X-ray photoelectron spectroscopy further demonstrated that the Ni composite film was Ni-S alloy doped with thiourea and Cu 2 O. Traces of thiourea and the doping of Cu 2 O in the film should play a promotional role in the improvement of anti-corrosion performance. Therefore, electrochemical measurements and high-temperature oxidation test indicated that the Ni composite film could be a cost-effective and efficiently anti-corrosion coating on the Cu substrate with sufficiently high corrosion resistance.