Thermal Stress Simulation of Motor-Control Circuit Boards Using Finite Angle Motors: Heat Dissipation and Structural Optimization Through COMSOL Coupling Analysis

To accelerate the transition from design to production and enhance the reliability of motorcontrol circuit boards, a coupling simulation analysis of thermal stress and heat transfer has been conducted using COMSOL Multiphysics software.The investigation focuses on the thermal performance of the circuit board at 85, examining the effects of copper layer thickness on heat dissipation.The influence of heat dissipation through-holes on thermal management was also explored to determine optimal design parameters.A systematic approach was adopted to optimize copper skin thickness and through-hole configurations, with the goal of minimizing thermal stress and deformation displacement.COMSOL was employed to validate the effectiveness of the proposed cooling scheme.The simulation results indicate that the optimized design reduces average temperature by 9.86%, mitigates thermal stress by 10.47%, and lowers deformation displacement by 22.4%, confirming the feasibility of the thermal management strategy.These findings offer practical insights into the structural layout and lamination design of motor-control circuit boards, with implications for improving product development efficiency and reliability.