Approaches to nanosolder reflow at the nanoscale

Nanosoldering is a way of bottom-up manufacturing that can establish close, strong contact between individual nanoobjects. The reflow of nanosolder plays a vital role in achieving such reliable contact. Here, we propose an in situ reflow approach that uses Joule heating induced by electrical current flowing through the nanosolder as a heating source in scanning electron microscopy. This method facilitated the reflow of 97Sn3Cu nanosolder at approximately 2.9 μJ of Joule heat, without requiring flux. Additionally, we have performed other reflow approaches for reflow tests of 97Sn3Cu nanosolder. This paper eager to provide valuable approaches for nanosolders reflow, aiming at enhancing their application in nanosoldering.