Gas Box Exhaust Design Modification for Accidental Hazardous Gas Releases in Semiconductor Industry

Hazardous substances such as hydrogen and chlorine are used in semiconductor manufacturing. When these gasses are discharged, they are mixed with outside air and are connected to a treatment facility through a duct inside a gas box. This study investigated an optimal exhaust design to prevent fire explosions and toxic exposure by optimizing the exhaust volume when hazardous substances leak from the gas box of semiconductor manufacturing equipment. In this study, carbon monoxide was used for modeling. A 75 mm duct was used, and the tracer gas was released into the gas box at 15.4 LPM. The concentrations were measured at nine points inside and outside the gas box. According to the test results, in an experiment designed with 0% air intake, the internal leakage concentration was measured to be more than 25% of the LEL (lower explosive limit) for 10 min when leakage occurred due to stagnant flow, and the outside toxicity concentration was also measured to be more than 50% of the TWA (time-weighted average) value. When the air intake ratio was designed to be 100%, there was a point on the outside that exceeded 50% of the TWA, confirming that excessive air intake could also cause gas to leak outside. Finally, when the intake ratio was designed to be 50% in both directions, it was confirmed that the airflow was maintained smoothly, and the hazardous gasses were safely diluted and discharged through the duct. This study was conducted to improve the safety of workers in the field in the event of leakage of flammable and toxic gasses by testing the location and area of the air intake hole in the gas box exhaust port. Through this effort, the aim is to present specific standards for gas box design and to assist in establishing a legal framework or standardized guidelines.