Full Antenna in Package Solution for 100GHz 6G infrastructure, in 140nm SiGe BiCMOS Technology
In this paper we describe a 64 channel Antenna in Package (AIP) solution, containing 4 16-channel Analog Beam Former (ABF) ICs and 1 Up-Down Converter (UDC) designed and fabricated in a 140nm SiGe BiCMOS in-house Technology. This AIP can be used both for user equipment and as building block in larger phased array antenna panels for 6G infrastructure equipment operating at 100GHz.
Authors
- P.H.C. Magnée
- Philipp Franz Freidl
- Ola Tageman
- Rajesh Mandamparambil
- J.J.T.M. Donkers
- Gaurav Bisht
- Metin H. Acar (ORCID: https://orcid.org/0000-0001-8953-1905)
- P. Mattheijssen
- Wan‐Chun Liao (ORCID: https://orcid.org/0000-0002-4991-9961)
- Mohan Lal (ORCID: https://orcid.org/0000-0001-6995-3377)
- Xiaofeng Yang (ORCID: https://orcid.org/0009-0009-0764-6174)
- Konstantinos Giannakidis
- Ayad Ghannam
- Ihor Brunets
- P.G.M. Sebel
- Zhe Chen (ORCID: https://orcid.org/0000-0002-2919-4481)
- J. Bergman
- D.M.W. Leenaerts
- Stig Danielsson
Institutions
- Ericsson (Sweden) (SE)
- NXP (Germany) (DE)
- Silicon Labs (United States) (US)
Publication Details
- Published
- 2024-10-27
- DOI
- https://doi.org/10.1109/bcicts59662.2024.10745657
- Citations
- 2
- Primary Topic
- Antenna Design and Analysis
- Type
- article
- Field-Weighted Citation Impact
- 2.60
Funders
- Rijksdienst voor Ondernemend Nederland
- VINNOVA
- Ministry of Economic Affairs