InC2: Design of Interconnection Systems for Composable Chiplet Architectures

Chiplets of different types of processors, different generations of processors, as well as processors from different vendors are now being integrated using modern packaging technologies for economic scaling of performance. Unfortunately, current state-of-art architectures and designs do not efficiently adapt to the new constraints posed by these packaging technologies. Specifically, for tighter integration of chiplets, there is a need to define the architectural and microarchitectural implementation of interconnection systems such that a package can support chiplets from different sources.This work, dubbed INC2, identifies and proposes efficient design guidelines for Interconnection Systems for Chiplet Composability. We analyze the design space and propose design guidelines and novel designs that chiplet architects should align with for future composability of the chiplet as well as for efficient operation.