Effect of TGP’s compression ratio on the vibration response of PCBA

Abstract The influence of the compression ratio of the thermal conductive pad (TCP) on vibration response characteristics of airborne electronic equipment is investigated. The acceleration and strain in three cases, i.e. with no thermal conductive pad, the compression ratio of 10% and 55%, are studied respectively. The results show that, by using a thermal conductive pad, the acceleration and strain can be reduced significantly. The response of acceleration and strain with different compression ratios are significantly different. A high compression ratio can increase the vibration response. An unreasonable selection of thermal conductive pads can result in high stress in the surroundings of screws and chips, which will lead to component failure.