Thermal design of a frequency hopping processor

Abstract To solve the difficult problems in the thermal design of a new frequency-hopping processor, such as high heat consumption, concentrated local heat flux of the device, and large thermal resistance, a thermal design scheme was proposed to optimize the structure design and enhance the thermal conductivity of PCB board. At the same time, a combined scheme of copper water heat pipe-thermal expansion plate was used. Flotherm was used for thermal simulation and a thermal balance experiment under vacuum conditions was designed. Then the temperature of the frequency-hopping processor was measured experimentally to further verify the rationality of the design scheme. The combined scheme of copper water heat pipe-thermal expansion plate will guide the thermal design of this type of frequency hopping processor.