Crimp Height influence over Resistivity in Wiring Crimping Process

Abstract The main purpose of this paper is to present the influence between the crimp height and the resistivity for a crimp joint between a copper contact and a wire copper stranded cable using statistical relevant analysis. The experiment followed the analysis of 45 crimped assemblies grouped in 3 main categories to simulate a potential validation procedure according to the international validation process requirements from: DIN (“Deutsches Institut fu r Normung”) with the corresponding Romanian standard SR EN 60352-2:2006 and SAE/USCAR-21 REVISION 3. The baseline used was the behaviour of the resistivity versus the pre-set crimp height of the crimped joints before and after thermal shock test to enable us to conclude if we have a significant relation between the crimp height of the assembly joint and the resistivity.