Effect of different parameters on mode I fracture toughness of resin samples manufactured by DLP

Abstract Additive manufacturing is spreading rapidly in almost all industries, from household to advanced engineering. Components produced by Digital Light Processing (DLP) are not comprehensively characterized, but exceed the capabilities of many AM processes. Its advantages include the ability to produce highly complex designs, superior precision, fast printing and lower operating costs. The present paper investigates the mode I fracture toughness (K IC ) of UV-sensitive resin specimens obtained through DLP process. Single edge notch bending (SENB) specimen were 3D printed and tested according to the ASTM D5045 standard. The influence of printing orientation-PO (0°, 45° and 90°), resin color-RC (white, black and transparent) and corrosive environment-CE (air, water and saline solution) was studied. It was observed that all the studied parameters have some effect on the fracture properties. The highest K IC values were obtained for 45°-PO, white-RC (1.88 MPa•m 0.5 ) and saline solution-CE (2.24 MPa•m 0.5 ). However, the greatest influence is highlighted by RC (∼92%), while CE (∼32%) shows a minimal effect. The fracture surface of the investigated samples is influenced by the printing parameters.