Monolithically Integrated Bidirectional Gate ESD Protection Scheme of p-GaN Power HEMT by Dual-Gate Device Technology

This letter proposes a monolithically integrated bidirectional gate electrostatic discharge protection scheme for p-GaN power high-electron-mobility transistors (HEMTs), in which a dual-gate HEMT is designed as the discharging transistor. With this protection scheme, the forward/reverse transmission line pulsing failure current is enhanced from 0.156 A/0.08 A to 1.36 A/5.26 A, almost without sacrificing performances of the p-GaN power HEMT. Thanks to the bidirectional switching characteristics of the dual-gate device by sharing the drift region, only one discharging transistor is required in the scheme; as a result, the area of this protection scheme can be effectively saved by 40.8% compared to state-of-the-art scheme with the same protection capability.

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Publication Details

Journal
IEEE Transactions on Power Electronics
Published
2024-11-08
DOI
https://doi.org/10.1109/tpel.2024.3494833
Citations
8
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
2.49
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article

Monolithically Integrated Bidirectional Gate ESD Protection Scheme of p-GaN Power HEMT by Dual-Gate Device Technology

Jie Ma, Jiaxing Wei, Ran Ye, Yanfeng Ma et al.
8 citations
IEEE Transactions on Power Electronics
GaN-based semiconductor devices and materials
2.49
article

Monolithically Integrated Bidirectional Gate ESD Protection Scheme of p-GaN Power HEMT by Dual-Gate Device Technology

Jie Ma, Jiaxing Wei, Ran Ye, Yanfeng Ma, Sheng Li, Long Zhang, Chi Zhang, Siyang Liu, Mingfei Li, Weifeng Sun, Weihao Lu, Lixi Wang
article en
8 citations

Abstract

This letter proposes a monolithically integrated bidirectional gate electrostatic discharge protection scheme for p-GaN power high-electron-mobility transistors (HEMTs), in which a dual-gate HEMT is designed as the discharging transistor. With this protection scheme, the forward/reverse transmission line pulsing failure current is enhanced from 0.156 A/0.08 A to 1.36 A/5.26 A, almost without sacrificing performances of the p-GaN power HEMT. Thanks to the bidirectional switching characteristics of the dual-gate device by sharing the drift region, only one discharging transistor is required in the scheme; as a result, the area of this protection scheme can be effectively saved by 40.8% compared to state-of-the-art scheme with the same protection capability.

IEEE Transactions on Power ElectronicsVol. 40(2)
WuXi AppTec (China) (CN), Southeast University (CN), United Microelectronics (United States) (US)
Affordable and clean energy
Openalex Percentile: Top 10%
GaN-based semiconductor devices and materials
2.49
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Monolithically Integrated Bidirectional Gate ESD Protection Scheme of p-GaN Power HEMT by Dual-Gate Device Technology — Jie Ma, Jiaxing Wei, et al. · IEEE Transactions on Power Electronics (2024) | TGRS Research Map | TGRS