An active ester‐cured resveratrol‐based epoxy film with excellent thermal and dielectric performances for high‐frequency applications

Abstract In the field of electronic packaging, epoxy resins with good thermal and dielectric performances have attracted extensive attention. In this work, a novel epoxy resin was synthesized from resveratrol, and its structure was characterized by NMR and FTIR. The resveratrol‐based epoxy resin was cured with an active ester, and the properties of the cured system were further studied. The results showed that the resveratrol‐based epoxy cured with active ester had excellent comprehensive properties, its dielectric constant ( D k ) was 2.63, dissipation factor ( D f ) was 4.91‰ at high frequency of 10 GHz; moreover, its glass transition temperature ( T g ) was 188°C, coefficient of thermal expansion (CTE) was 70.7 ppm/°C, 5% mass loss temperature ( T d5% ) was 390°C. These results suggested that a biomass epoxy resin with excellent thermal and dielectric performances had been successfully synthesized, which had potential application in the field of high‐frequency communication.