Evaluating Substrate Influence on Rectangular and Circular Microstrip Patch Antennas for 5G

Microstrip Patch Antennas (MSPAs) are favored for their low production cost, compact size, lightweight nature, and adaptability to planar and non-planar surfaces. They are particularly suitable for wideband and multi-frequency operations, making them ideal for sub-6 GHz applications in 5G devices. This study aims to design and compare rectangular and circular MSPAs using six different substrates: FR4 Glass Epoxy (dielectric constant 4.3), ROGERS DT5880 (2.2), ROGERS 4003C (3.3), Teflon (2.1), Arlon AD300A (3), and Alumina (9.9). Using CST Microwave Studio, we first design rectangular MSPAs and then circular MSPAs, maintaining a 1.6 mm substrate height and using Copper (Anneal) for both the patch and ground materials. The target frequency is 5.8 GHz, relevant for 5G applications. By comparing the antenna parameters across different substrates, we aim to identify the optimal substrate and antenna design for future technology needs.