Dynamic visualization study of in situ cleaning of polystyrene microparticles off silicon wafer surface

With the improvement of chip performance, the requirements for cleaning the surface of silicon wafers are becoming higher. However, due to equipment and technology, it is difficult to observe the complex motion processes of particles at the microscopic scale. In this paper, an in situ dynamic visualization experiment on the cleaning of Polystyrene Latex (PSL) on the surface of silicon wafers is carried out by using a high-speed camera and image processing software. The mechanical behavior of PSL particles in fluid was investigated on a microscopic scale, and the trajectory and force of the polystyrene particles on the surface of the wafers were visualized, which provided a new perspective for understanding the complex cleaning process. Theoretical models were developed to explain the motion characteristics of the particles by calculating parameters such as van der Waals force, surface tension, and trailing force, and these models provide a theoretical basis for optimizing the cleaning process. There are four particle motion modes in the fluid: (1) interface capture, where the particles on the surface of silicon wafer are trapped by gas–liquid interface under surface tension; (2) particle collision, where the particles captured by the water film collide with the particles on the wafer surface to make the latter leave the silicon wafer; (3) jump attachment, where the particles jump and attach to the surface of the particle group under the action of lift; and (4) wall surface movement, where the particles start up under the action of water flow and then leave the silicon wafer quickly.