ML-TIME: ML-driven Timing Analysis of Integrated Circuits in the Presence of Process Variations and Aging Effects

Integrated circuits at advanced technology nodes are prone to process variations and early life failures due to aging. Variations in transistor parameters lead to a degraded on-current which, in turn, results in increasing gate-level propagation delay. Similarly, threshold voltage shifts due to aging effects result in increased path delays and erstwhile latent defects manifesting as early life failures (ELFs). We propose ML-TIME, a novel machine learning-based framework to simulate path delays in an integrated circuit in the presence of process variations and aging effects. While conventional static timing analysis (STA) tools can only compute path delays at well-defined process-voltage-temperature corners, ML-TIME can be used to obtain a statistical distribution of the path delays under user-defined process variations and aging specifications. Such distributions can be used to identify paths that are susceptible to either process variations or aging effects or both and can enable designers to make remedial changes. Simulation results across multiple benchmarks and standard cell libraries demonstrate that the MLTIME can accurately predict critical path delays under variations and aging, with an error margin of less than 1.7%, all without the need for computationally expensive circuit simulations.

Authors

Institutions

Publication Details

Published
2024-09-09
DOI
https://doi.org/10.1109/mlcad62225.2024.10740249
Citations
1
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.21
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

ML-TIME: ML-driven Timing Analysis of Integrated Circuits in the Presence of Process Variations and Aging Effects

Peter Domanski, Krishnendu Chakrabarty, Sanmitra Banerjee, Xuanyi Tan
1 citations
Semiconductor materials and devices
0.21
article

ML-TIME: ML-driven Timing Analysis of Integrated Circuits in the Presence of Process Variations and Aging Effects

Peter Domanski, Krishnendu Chakrabarty, Sanmitra Banerjee, Xuanyi Tan
article en
1 citations

Abstract

Integrated circuits at advanced technology nodes are prone to process variations and early life failures due to aging. Variations in transistor parameters lead to a degraded on-current which, in turn, results in increasing gate-level propagation delay. Similarly, threshold voltage shifts due to aging effects result in increased path delays and erstwhile latent defects manifesting as early life failures (ELFs). We propose ML-TIME, a novel machine learning-based framework to simulate path delays in an integrated circuit in the presence of process variations and aging effects. While conventional static timing analysis (STA) tools can only compute path delays at well-defined process-voltage-temperature corners, ML-TIME can be used to obtain a statistical distribution of the path delays under user-defined process variations and aging specifications. Such distributions can be used to identify paths that are susceptible to either process variations or aging effects or both and can enable designers to make remedial changes. Simulation results across multiple benchmarks and standard cell libraries demonstrate that the MLTIME can accurately predict critical path delays under variations and aging, with an error margin of less than 1.7%, all without the need for computationally expensive circuit simulations.

University of Stuttgart (DE), Nvidia (United States) (US), Arizona State University (US)
Affordable and clean energy
Openalex Percentile: Top 46%
Semiconductor materials and devices
0.21
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.