System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application

The on-chip micro supercapacitor (MSC), renowned for its exceptional capacitance and power density, holds great potential in compactifying micro systems by replacing bulky dielectric capacitors. However, traditional electrochemical materials and fabrication methods of MSC are incompatible with standard IC processes, posing a significant obstacle to its widespread application. In this paper, we report a novel strategy for fabricating an IC-compatible MSC with ultrahigh capacitance density on wafer-level. Specifically, we design a mesoporous Cu@CuxO material for MSC electrode, in which Cu is a common IC interconnection material with low cost and high conductivity, while CuxO covers Cu to provide large electrochemical capacity. This material is prepared by using standard co-sputtering, selective etching and in-situ oxidation processes sequentially. Subsequently, it is employed to construct high aspect ratio interdigital electrode (nearly <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$20~\mu $ </tex-math></inline-formula>m thickness) using developed ultra-thick peeling off technology. As a result, the MSC exhibits a superior capacitance density of 35.58 mF/cm2, surpassing commercial dielectric capacitors by 2 orders of magnitude. Furthermore, we propose a unique MSC packaging method based on 3D printing, which includes specially designed microchannels for liquid electrolyte injection and microgrooves for IC chip integration. This packaging method facilitates the integration of MSC with a power management integrated chip (PMIC), forming a System-in-Packaged (SiP) power module. This module, with dimensions of only <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$3.2\times 2.7\times 1$ </tex-math></inline-formula> mm3, successfully manages the output of a triboelectric nanogenerator, demonstrating its practical application and vast potential.[2024-0073]

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Publication Details

Journal
Journal of Microelectromechanical Systems
Published
2024-11-05
DOI
https://doi.org/10.1109/jmems.2024.3485876
Citations
1
Primary Topic
Supercapacitor Materials and Fabrication
Type
article
Field-Weighted Citation Impact
0.12

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article

System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application

Jian Zhou, Zhangshanhao Li, Siyao Jiang, Jianyou Dai et al.
1 citations
Journal of Microelectromechanical Systems
Supercapacitor Materials and Fabrication
0.12
article

System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application

Jian Zhou, Zhangshanhao Li, Siyao Jiang, Jianyou Dai, Zhanpeng Shi, Minghao Xu, Dongping Zheng, Sixing Xu, Lei Shan, Xiaohong Wang
article en
1 citations

Abstract

The on-chip micro supercapacitor (MSC), renowned for its exceptional capacitance and power density, holds great potential in compactifying micro systems by replacing bulky dielectric capacitors. However, traditional electrochemical materials and fabrication methods of MSC are incompatible with standard IC processes, posing a significant obstacle to its widespread application. In this paper, we report a novel strategy for fabricating an IC-compatible MSC with ultrahigh capacitance density on wafer-level. Specifically, we design a mesoporous Cu@CuxO material for MSC electrode, in which Cu is a common IC interconnection material with low cost and high conductivity, while CuxO covers Cu to provide large electrochemical capacity. This material is prepared by using standard co-sputtering, selective etching and in-situ oxidation processes sequentially. Subsequently, it is employed to construct high aspect ratio interdigital electrode (nearly <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$20~\mu $ </tex-math></inline-formula>m thickness) using developed ultra-thick peeling off technology. As a result, the MSC exhibits a superior capacitance density of 35.58 mF/cm2, surpassing commercial dielectric capacitors by 2 orders of magnitude. Furthermore, we propose a unique MSC packaging method based on 3D printing, which includes specially designed microchannels for liquid electrolyte injection and microgrooves for IC chip integration. This packaging method facilitates the integration of MSC with a power management integrated chip (PMIC), forming a System-in-Packaged (SiP) power module. This module, with dimensions of only <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$3.2\times 2.7\times 1$ </tex-math></inline-formula> mm3, successfully manages the output of a triboelectric nanogenerator, demonstrating its practical application and vast potential.[2024-0073]

Journal of Microelectromechanical SystemsVol. 34(1)
Hunan University (CN), Tsinghua University (CN)
National Natural Science Foundation of China, Natural Science Foundation of Hunan Province
Affordable and clean energy
Openalex Percentile: Top 65%
Supercapacitor Materials and Fabrication
0.12
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