Research on Adhesion Pull-Off Behavior of Rigid Flat Punch and Viscoelastic Substrate

Interfacial adhesion is one of the key factors affecting the reliability of micro–nano systems. The adhesion contact mechanism is still unclear as the time-dependent viscoelasticity of soft materials. To clarify the adhesion interaction, the pull-off detachment between the rigid flat punch and viscoelastic substrate is explored considering the viscoelasticity of soft materials and rate-dependent adhesion. Taking the Lennard-Jones (L-J) potential characterizing interfacial adhesion and the Prony series defining the viscoelasticity of materials as references, the bilinear cohesion zone model (CZM) and standard Maxwell model are employed, and an adhesion analysis framework is established by combining finite element technology. The influence laws of the loading and unloading rates, material relaxation coefficients and size effect on adhesion pull-off behavior are revealed. The results show that the pull-off force is independent of the material relaxation effect and related to the unloading rate. When v^ ≥ 50 or v^ < 0.01, the pull-off force has nothing to do with the unloading rate, but when 0.01 < v^ < 50, the pull-off force increases with the increasing unloading rate. Also, it is controlled by the size effect, and the changing trend conforms to the MD-n model proposed by Jiang. The energy required for interfacial separation (i.e., effective adhesion work) is a result of the comprehensive influence of unloading rates, material properties and the relaxation effect, which is consistent with Papangelo1’s research results. In addition, we derive the critical contact radius of the transition from the Kendall solution to the strength control solution. This work not only provides a detailed solution for the interfacial adhesion behavior but also provides guidance for the application of adhesion in Micro-Electro-Mechanical Systems (MEMSs).