Effects of cold rolling path on recrystallization behavior and mechanical properties of pure copper during annealing

The recrystallization behavior, grain boundary characteristic distribution, and mechanical properties of pure Cu sheets that were subjected to different cold rolling paths, and then annealed at 400 °C for 10, 30, 60, and 420 min, were investigated. Different rolling paths changed the grain boundary orientations of cold-rolled copper, causing recrystallized grains to nucleate and grow in an oriented manner. However, the evolution of the texture indicated that cold-rolled copper with different rolling paths did not show an obvious preferred orientation after annealing. The RD-60 specimen exhibited the smallest grain size (6.6 μm). The results indicated that the grain size and low-Σ CSL grain boundaries worked together to provide RD-60 samples with appropriate mechanical properties and high plasticity. The yield strength, ultimate tensile strength, and elongation of RD-60 sample were 81 MPa, 230 MPa, and 49%, respectively. These results could provide guidance for tuning the microstructures and properties of pure Cu foils, as well as designing fabrication routes for pure Cu foils through processes such as rolling and drawing.