Analysis of Delay and Dynamic Crosstalk in Spatially Arranged Mixed CNT Bundle Interconnects at Different Technology Nodes

In the present nanoscale regime, mixed carbon nanotube bundles (MCBs) are considered to be highly promising interconnect options. This research paper introduces a spatially arranged mixed carbon nanotubes (CNTs) bundle (MCB), wherein single-walled CNTs (SWCNTs) and multi-walled CNTs (MWCNTs) occupy equal halves in the MCB. An equivalent single conductor (ESC) model for MCB is employed to analyze the interconnect performances in terms of signal transmission delay and dynamic crosstalk delay at different technology nodes (i.e., 32nm, 22nm, and 16 nm). Encouragingly, a significant reduction in signal transmission delay and dynamic crosstalk induced delay are observed at 32 nm technology node. It is observed that at 32 nm technology node, the propagation delay and crosstalk induced delay significantly improves by 29.40% and 55.53%, respectively, compared to 22 nm technology node and 187.88% and 185.94%, respectively, compared to 16 nm technology node. The improvement in interconnect performances can primarily be attributed to the improvement in the number of conducting channels inside the MCB at 32 nm, which greatly impacted the interconnect parasitics such as quantum resistance, quantum capacitance, kinetic inductance etc.

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Publication Details

Journal
Key engineering materials
Published
2024-11-05
DOI
https://doi.org/10.4028/p-vcvy4l
Primary Topic
3D IC and TSV technologies
Type
article
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article

Analysis of Delay and Dynamic Crosstalk in Spatially Arranged Mixed CNT Bundle Interconnects at Different Technology Nodes

P. Das, Anurag Yadav, Nidhi Chandra
Key engineering materials
3D IC and TSV technologies
article

Analysis of Delay and Dynamic Crosstalk in Spatially Arranged Mixed CNT Bundle Interconnects at Different Technology Nodes

P. Das, Anurag Yadav, Nidhi Chandra
article en

Abstract

In the present nanoscale regime, mixed carbon nanotube bundles (MCBs) are considered to be highly promising interconnect options. This research paper introduces a spatially arranged mixed carbon nanotubes (CNTs) bundle (MCB), wherein single-walled CNTs (SWCNTs) and multi-walled CNTs (MWCNTs) occupy equal halves in the MCB. An equivalent single conductor (ESC) model for MCB is employed to analyze the interconnect performances in terms of signal transmission delay and dynamic crosstalk delay at different technology nodes (i.e., 32nm, 22nm, and 16 nm). Encouragingly, a significant reduction in signal transmission delay and dynamic crosstalk induced delay are observed at 32 nm technology node. It is observed that at 32 nm technology node, the propagation delay and crosstalk induced delay significantly improves by 29.40% and 55.53%, respectively, compared to 22 nm technology node and 187.88% and 185.94%, respectively, compared to 16 nm technology node. The improvement in interconnect performances can primarily be attributed to the improvement in the number of conducting channels inside the MCB at 32 nm, which greatly impacted the interconnect parasitics such as quantum resistance, quantum capacitance, kinetic inductance etc.

Key engineering materialsVol. 994
Sant Longowal Institute of Engineering and Technology (IN)
Openalex Percentile: Top 83%
3D IC and TSV technologies
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Analysis of Delay and Dynamic Crosstalk in Spatially Arranged Mixed CNT Bundle Interconnects at Different Technology Nodes — P. Das, Anurag Yadav, et al. · Key engineering materials (2024) | TGRS Research Map | TGRS