Preparation and Performance Study of Thermally Conductive Silicone Adhesive Applying in Flip Chip Ball Grid Array

A thermally conductive silicone adhesive UB-5715 was prepared using vinyl silicone oil of medium viscosity, hydrogen-containing silicone oil and micron alumina powder. The results revealed that UB-5715 demonstrated superior thermal and mechanical properties. Specifically, its thermal decomposition temperature exceeded 400 °C, the thermal conductivity coefficient surpassed 1.80 W/m·K, the thermal resistance was under 12.0 °C·cm 2 /W, the shear strength reached achieved was over 5.00 MPa. Meanwhile, after being subjected to uHAST for 384 hours, thermal cycle for 1000 times and heat aging for 1000 hours respectively, UB-5715 still maintained its high thermal conductivity coefficient and mechanical properties. The thermal conductivity coefficient still exceeded 1.70 W/m·K, shear strength still surpassed 5.00 MPa, the tensile modulus remained below 100 MPa, the linear expansion coefficient was less than 160 ppm/°C, and its comprehensive performance met the reliability requirements for advanced packaging process substrates and heat dissipation cover assemblies.