Modified Si Oxidation Behavior by Ultrathin Ni Catalyst Enabling Oxidant‐Less Metal‐Assisted Chemical Etching

Metal-assisted chemical etching (MACE), a wet-based anisotropic etching process for semiconductors, has emerged as an alternative to plasma-based etching. However, using noble metal catalysts in MACE limits the implementation of complementary metal-oxide-semiconductor (CMOS) processes. This study explores Si etching using an ultrathin Ni catalyst as a novel approach for MACE. The thickness of the Ni catalyst emerges as a critical parameter, with 1 nm of Ni proving to be the optimal thickness to achieve smooth and deep etching. Unlike conventional MACE methods, the ultrathin Ni catalyst enables Si etching without strong oxidants. Wafer-scale Si etching demonstrates the versatility of the ultrathin Ni catalyst in producing various microstructures. It is found that the ultrathin Ni/Si interfacial state plays a crucial role in influencing the Si reactivity, lowering the barrier for Si oxidation. CMOS-compatible and cost-efficient ultrathin Ni makes MACE a promising alternative for semiconductor nanofabrication. This study pioneers MACE using an ultrathin non-noble metal catalyst, offering valuable insights for researchers in this field.