Influence of bonding properties at the NiTi-SMA wire/epoxy resin interface
To study the influence of various factors on the interfacial bonding performance between nickel-titanium shape memory alloy (NiTi-SMA) wire and epoxy resin. The bonding strength of the SMA wire/epoxy resin interface was determined by SMA wire pull-out tests, focusing on the effects of adhesive type and SMA wire bonding length on the interface failure mode and bonding strength. The results indicate that the failure mode of Sikadur-330 CN and Lica-102 is interfacial bonding failure between SMA wire and epoxy resin, and the effective bonding length is between 2.0 cm and 3.0 cm. The epoxy impregnated resin Sikadur-330 CN exhibits the best bonding performance. This study can provide theoretical support for the design, preparation, and practical engineering application of FRP/SMA composite materials.
Authors
- Chunling Lu (ORCID: https://orcid.org/0000-0002-4780-9451)
- Shengzhi Du (ORCID: https://orcid.org/0000-0001-5166-1069)
- Xiao Gan (ORCID: https://orcid.org/0000-0002-1605-093X)
- Qiang Wang (ORCID: https://orcid.org/0000-0002-1219-7889)
Institutions
- Guilin University of Technology (CN)
Publication Details
- Published
- 2024-11-04
- DOI
- https://doi.org/10.1117/12.3054952
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00