Vertical GaN Devices: Reliability Challenges and Lessons Learned from Si and SiC

We discuss recent advancements in the development of vertical GaN devices, and the related reliability challenges. Key results indicate that: (i) vertical GaN devices can show high performance, low background doping, and kV-range breakdown voltages; avalanche capability (a property of Si and SiC devices) is demonstrated also for vertical devices on silicon substrate, enabling reliable high-voltage operation; (ii) threshold voltage instabilities are related to the presence of interface and border traps, whose contribution can be modeled with great accuracy by prior characterization of the trap distribution profile; (iii) gate stack reliability is mainly limited by oxide breakdown; factors limiting off-state failure are discussed. Strategies for device improvement are proposed, also based on the learnings from silicon and silicon carbide technology.

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Published
2024-12-07
DOI
https://doi.org/10.1109/iedm50854.2024.10873536
Citations
2
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.62

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Vertical GaN Devices: Reliability Challenges and Lessons Learned from Si and SiC

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GaN-based semiconductor devices and materials
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article

Vertical GaN Devices: Reliability Challenges and Lessons Learned from Si and SiC

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article en
2 citations

Abstract

We discuss recent advancements in the development of vertical GaN devices, and the related reliability challenges. Key results indicate that: (i) vertical GaN devices can show high performance, low background doping, and kV-range breakdown voltages; avalanche capability (a property of Si and SiC devices) is demonstrated also for vertical devices on silicon substrate, enabling reliable high-voltage operation; (ii) threshold voltage instabilities are related to the presence of interface and border traps, whose contribution can be modeled with great accuracy by prior characterization of the trap distribution profile; (iii) gate stack reliability is mainly limited by oxide breakdown; factors limiting off-state failure are discussed. Strategies for device improvement are proposed, also based on the learnings from silicon and silicon carbide technology.

University of Modena and Reggio Emilia (IT), Centre National de la Recherche Scientifique (FR), University of Padua (IT), Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR), Ferdinand-Braun-Institut (DE), Institut d'Electronique, de Microélectronique et de Nanotechnologie (FR), Consorzio Nazionale Interuniversitario per la Nanoelettronica (IT), Robert Bosch (Germany) (DE)
European Commission, Electronic Components and Systems for European Leadership
Openalex Percentile: Top 32%
GaN-based semiconductor devices and materials
0.62
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