Patternable, high-precision, controllable wettability copper layers for 3D resin-based weather-resistant electronics and 3D liquid manipulation

The realization of 3D patterned metal layers with manipulable surface wettability has significant potential, especially in integrating microelectronics with weather resistance and multifunctional liquid manipulation. However, developing a facile and efficient method to bring it to fruition remains a great challenge. In this work, we proposed a novel 3D selective metallization strategy that combines stereolithography 3D printing with laser-induced selective metallization (LISM). Utilizing 355 nm UV or 1064 nm lasers, this strategy can prepare 3D conductive copper patterns (or circuits) with controlled wettability on various 3D-printed resin parts. The copper layer surface prepared <i>via</i> LISM formed microstructures similar to the papillae on the surface of a lotus leaf, and it spontaneously exhibited superhydrophobicity (156.6°) after aging in the air at room temperature. Superhydrophobic 3D circuits with self-cleaning, corrosion-resistant, and anti-condensation performance were successfully fabricated. By further treating the copper layer with a 355 nm UV laser, we realized the transformation of the superhydrophobic copper layer to a superhydrophilic state, enabling us to prepare high-precision superhydrophilic patterns or channels. A 3D self-driven flow channel was fabricated to successfully realize 3D liquid manipulation and small-scale chemical experiments.