In Situ Construction of Polypyrrole–Silver Composite Conductive Phase in High‐Performance Polyimide Sponge and Study of Sensing Behavior Under Microstress

Composites comprising conductive polymers and metal particles have garnered considerable interest in sensor technology due to their excellent electrical conductivity. However, producing controllable pressure sensors that retain high sensitivity under microstress remains challenging. Polyimide (PI) sponge exhibits excellent chemical and thermal stability and a porous structure that facilitates considerable deformation under low stress levels and results in good sensitivity to external forces. Herein, a conductive polymer–metal composite conductive phase, polypyrrole–silver (PPy–Ag), is directly fabricated on the PI surface through incipient network conformal growth. This method ensures that the PPy–Ag composite maintains optimal performance within its original temperature range, thereby enhancing detection sensitivity at low stress levels. The maximum conductivity of the fabricated PPy–Ag/PI composite sponge‐based flexible piezoresistive sensor is 2.42 × 10 −4 S m −1 , and the sensitivity is recorded at 16.31 kPa −1 within a stress range of 0–80 Pa. After undergoing 1000 compression cycles, the sensor exhibits commendable stability and reproducibility.