Polystyrene Novel Composites with Enhanced Thermal Stability and Improvised Conductivity

Polymers having thermal stability and thermal conductivity are taken as the hot cake in the market these days. Manufacturing industries are focusing over the functional polymers with thermal management in aviation, electronics and other heat sink applications. In this research, general purpose polystyrene (GPPS-550P) is melt extruded with modified boron nitride powder. The fabricated composite samples showed an increase of 67.43% in thermal conduction. An increase of 56 multiple also achieved in thermal stability of the newly developed composite. This might be a tangible addition to the industrial word for developing functional polymers that offers stability and heat management applications synergistically.