Substrate Integrated Waveguide in 3D Integrated Technology for D-Band Applications
A Substrate Integrated Waveguide developed in a 3D technology and implemented between two silicon dies is presented. This waveguide was designed to operate in the millimeter D-Band (110 GHz – 170 GHz). This first fabrication allows the validation of both the design and the proposed 3D technology for millimeter-wave applications. Indeed, a similar frequency behavior can be observed in the simulation and measurement results.
Authors
- Jordan Corsi (ORCID: https://orcid.org/0000-0003-1840-7506)
- Jean‐Daniel Arnould (ORCID: https://orcid.org/0000-0001-6676-8715)
- Emmanuel Pistono (ORCID: https://orcid.org/0000-0002-1202-9092)
- Loı̈c Vincent (ORCID: https://orcid.org/0000-0001-6340-9645)
- Olivier Valorge
- Christophe Dubarry (ORCID: https://orcid.org/0000-0002-6604-2997)
- Hajar Zidane
- Christopher Pouzou
Institutions
- Institut polytechnique de Grenoble (FR)
- Centre National de la Recherche Scientifique (FR)
- Commissariat à l'Énergie Atomique et aux Énergies Alternatives (FR)
- Laboratoire d'Électronique des Technologies de l'Information (FR)
- Université Grenoble Alpes (FR)
Publication Details
- Published
- 2024-09-23
- DOI
- https://doi.org/10.23919/eumic61603.2024.10732684
- Primary Topic
- Microwave Engineering and Waveguides
- Type
- article
- Field-Weighted Citation Impact
- 0.00