SiGe Transmitter and Receiver with Integrated Mixers and LO Chains for K/Ka Band Phased Array Systems

This paper presents a Ka-band transmitter and a K-band receiver RFICs for SatCom Phased-Array Systems. The circuits are fabricated by using 130-nm SiGe:C BiCMOS technology. They share the same architecture having 4-channels RF front end with integrated mixers and LO chain including the frequency multiplier. RX measurements results have shown 40 dB of gain, 2.7 dB of NF and 17 dB of image rejection with a total power consumption of 484 mW. TX RFIC achieves 25 dB of peak small signal gain and 8.5 dBm of OP1dB with a total power consumption of 690 mW. The area size, for both chips, amount to 12 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (pads included).

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Publication Details

Published
2024-09-23
DOI
https://doi.org/10.23919/eumic61603.2024.10732426
Citations
1
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
0.21

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article

SiGe Transmitter and Receiver with Integrated Mixers and LO Chains for K/Ka Band Phased Array Systems

Matteo Angelo Fumagalli, Alberto Colzani, Alessandro Fonte
1 citations
Radio Frequency Integrated Circuit Design
0.21
article

SiGe Transmitter and Receiver with Integrated Mixers and LO Chains for K/Ka Band Phased Array Systems

Matteo Angelo Fumagalli, Alberto Colzani, Alessandro Fonte
article en
1 citations

Abstract

This paper presents a Ka-band transmitter and a K-band receiver RFICs for SatCom Phased-Array Systems. The circuits are fabricated by using 130-nm SiGe:C BiCMOS technology. They share the same architecture having 4-channels RF front end with integrated mixers and LO chain including the frequency multiplier. RX measurements results have shown 40 dB of gain, 2.7 dB of NF and 17 dB of image rejection with a total power consumption of 484 mW. TX RFIC achieves 25 dB of peak small signal gain and 8.5 dBm of OP1dB with a total power consumption of 690 mW. The area size, for both chips, amount to 12 mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (pads included).

Institute for Microelectronics and Microsystems (IT)
European Commission
Affordable and clean energy
Openalex Percentile: Top 47%
Radio Frequency Integrated Circuit Design
0.21
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