Advanced Automatic Device Temperature Characterization for Hybrid STEM Learning

The Advanced Automatic Device Temperature Characterization for STEM learning leverages a universal learning platform base station and standard bench instruments for data acquisition and automation deployment, along with a custom- designed application board for circuit characterization. In this paper, we design and evaluate a low-cost automated temperature measurement system capable of obtaining calibrated junction and package temperatures for diodes and low-dropout voltage regulators. We employ self-heating as a cost-effective alternative to expensive temperature forcing systems by analyzing the ratio between heating and measurement time windows in each test. This method provides sufficient flexibility for gradually controlling junction temperature, above ambient conditions. Moreover, the reconfigurable application board's robustness is enhanced by using interchangeable daughter boards for temperature-stressed devices together with a custom-designed electronic load. Custom design and modularity improve the scalability of the learning environment in a hybrid delivery approach, fostering junction temperature measurements and self heating experiments in the range of 30-100°C, aligning with the highest STEM educational standards for university e-learning facilities.