Conformally printed additively manufactured RF demonstrator for circuit compaction

Abstract Recently, there has been interest in applying additive manufacturing (AM) to radio frequency (RF) and microwave applications, especially in packaging of microelectronic devices. Additive packaging offers advantages of expanded functionality in restricted volume, through miniature, low-SWaP-C sensors, allowing for non-traditional form factors. In this work, design, fabrication, and characterization of a non-planar monolithic microwave integrated circuit (MMIC) is presented to demonstrate significant footprint reduction and circuit compaction. Performance of a non-planar passive RF device and details of planar to non-planar AM connections for characterization of the transitions will be demonstrated. The work will present details of the design and fabrication of the non-planar structure, optimization of the process parameters for the Optomec 5-axis Aerosol Jet Printer for multi-material printing, and the results of the characterization and testing. RF measurements were conducted to demonstrate the functionality of the developed non-planar circuit and compared with simulations which showed good agreement. The results of this work show that fully additive approach is feasible for non-planar circuits, which will allow for footprint reduction, weight reduction, and achievement of novel form factors that are critical for microwave applications.