Improving the high-voltage insulation properties of polypropylene by introducing trace addition of polyvinylidene fluoride: An experimental and simulation study
Various additives ranging from inorganic nanoparticles to organic additives have been suggested to improve the insulation performance of polymeric materials for high-voltage engineering applications. Herein, a simple method for doping fluorine into a polypropylene (PP) matrix was presented by melt-blending of isotactic PP (iPP) with a small amount of polyvinylidene fluoride (PVDF) as a thermoplastic voltage stabilizer (TVS). During melt-mixing, the PVDF TVS, which is immiscible with PP, is gradually split into smaller domains within the iPP matrix and finely distributed, especially at a low PVDF content. The direct current (DC) breakdown strength (BDS) values of the PVDF-doped iPP increased by 110 % and 149 % at 25 and 110 °C, respectively, compared to those of the pristine PP, while its dielectric permittivity and loss tangent values remained nearly similar to those of iPP at wide temperature between 25 and 140 °C and frequency range between 1 Hz and 10 MHz. Quantum chemical simulation results reveal that a small amount of PVDF with high dipole moment introduces deep trap sites within the polymer matrix, which contribute for increasing BDS of iPP. Also, the PP with a small amount of PVDF dopants below 1.0 phr exhibited no any decrease in the tensile strength and elongation at break values. Therefore, the PVDF-doped iPP is anticipated as a potential candidate as high-performance high-voltage insulation materials for next-generation insulation applications.
Authors
- Jin Hong Lee (ORCID: https://orcid.org/0000-0001-6800-5543)
- Taehoon Kwon (ORCID: https://orcid.org/0000-0003-1253-319X)
- Masayuki Hikita (ORCID: https://orcid.org/0000-0002-1625-3016)
- Seong Hwan Lee
- Ik‐Su Kwon
- Seunggun Yu (ORCID: https://orcid.org/0000-0002-9374-744X)
- Masahiro Kozako (ORCID: https://orcid.org/0000-0003-2546-3725)
- Minhee Kim (ORCID: https://orcid.org/0000-0002-4143-1830)
- Dae Ho Lee (ORCID: https://orcid.org/0000-0001-7971-4441)
- Hana Kim (ORCID: https://orcid.org/0000-0003-2782-2859)
- Keisuke Shinozaki (ORCID: https://orcid.org/0000-0002-9613-2387)
- Do‐Kyun Kim (ORCID: https://orcid.org/0000-0002-3457-4868)
- Ohuk Lee
Institutions
- Korea Electrotechnology Research Institute (KR)
- Kyushu Institute of Technology (JP)
- Pusan National University (KR)
Publication Details
- Journal
- Composites Science and Technology
- Published
- 2024-10-31
- DOI
- https://doi.org/10.1016/j.compscitech.2024.110939
- Citations
- 5
- Primary Topic
- High voltage insulation and dielectric phenomena
- Type
- article
- Field-Weighted Citation Impact
- 0.59
Funders
- Korea Electrotechnology Research Institute