QUALITY CONTROL OF INSTALLATION OF ELECTRONIC MODULES AND MICROASSEMBLIES ON TEMPERATURE FIELDS AND TRANSIENT THERMAL CHARACTERISTICS

A brief overview of methods and tools for modeling and measuring the temperature fields of electronic modules and microassemblies and the transient thermal characteristics of their heat-loaded active elements for the purpose of diagnosing installation defects is presented.

Authors

В. А. Сергеев (ORCID: https://orcid.org/0000-0003-4854-2813)

Publication Details

Published: 2024-10-21
DOI: https://doi.org/10.61527/appfe-2024.15-18
Primary Topic: Advancements in Semiconductor Devices and Circuit Design
Type: article
Field-Weighted Citation Impact: 0.00

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article

QUALITY CONTROL OF INSTALLATION OF ELECTRONIC MODULES AND MICROASSEMBLIES ON TEMPERATURE FIELDS AND TRANSIENT THERMAL CHARACTERISTICS

В. А. Сергеев

Oct 21, 2024

Advancements in Semiconductor Devices and Circuit Design

article

QUALITY CONTROL OF INSTALLATION OF ELECTRONIC MODULES AND MICROASSEMBLIES ON TEMPERATURE FIELDS AND TRANSIENT THERMAL CHARACTERISTICS

В. А. Сергеев

October 21, 2024article en

Abstract

Affordable and clean energy

Openalex Percentile: Top 83%

Advancements in Semiconductor Devices and Circuit Design

DOI Open Access PDF OpenAlex

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QUALITY CONTROL OF INSTALLATION OF ELECTRONIC MODULES AND MICROASSEMBLIES ON TEMPERATURE FIELDS AND TRANSIENT THERMAL CHARACTERISTICS — В. А. Сергеев · (2024) | TGRS Research Map | TGRS