EVALUATION OF THE FATIGUE LIFE OF THE SOLDERED CONNECTION OF THE LED MATRIX WITH A BASE
Using the developed thermomechanical model, the temperature field and deformation movements of the layers of the LED matrix structure are determined. Calculations of the durability of the solder layer from the heat power dissipated by the LED matrix for three temperature modes of thermal cycling are carried out.
Authors
- В. А. Сергеев (ORCID: https://orcid.org/0000-0003-4854-2813)
- Alexander M. Hodakov
- A.D. Shuravin
- С. А. Зайцев
Publication Details
- Published
- 2024-10-21
- DOI
- https://doi.org/10.61527/appfe-2024.30-32
- Primary Topic
- Material Properties and Applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00