Preparation of Flexible Polymer Sensor Material by Spatial Confining Forced Network Assembly Micro Injection Molding

The development of high-performance flexible pressure-sensing materials necessitates the simultaneous achievement of exceptional flexibility, conductivity, and alignment of microstructure–nanostructure with the mechanical response characteristics inherent to these materials. In this study, we propose a novel method for preparing flexible microneedles as a pressure-sensitive sensor array. First, we obtain conductive composite particles through extrusion granulation, which consists of a compact conductive network with micron-scale filler as the skeleton and nanofiller filling in the gaps within the network. Moreover, by utilizing the “volume exclusion” effect of the microneedle array on the micron-scale filler during injection molding, nanofillers dominate in entering the microneedle. As a result, our molded product exhibits high flexibility and moderate conductivity in its pressure-sensitive area, thereby providing ultrahigh-pressure resistance along with desired response characteristics and sensitivity for sensors. In addition, due to synergistic effects between microscale fillers and nanofillers in nonpressure sensitive bases, a compact conductive network is formed that imparts sufficient conductivity to sensor materials. The method yields sensors with excellent repeatability, high dimensional accuracy, and good consistency, effectively addressing the core application challenges of flexible sensors. The microstructure array flexible sensor fabricated using high-precision injection molding technology offers high efficiency, low cost, and scalability for mass production. Furthermore, the sensitivity of sensors produced by this method is significantly higher—26.6% greater than those made using traditional methods—with a sensitivity as high as 4.71 kPa<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{-{1}}$ </tex-math></inline-formula>.

Authors

Institutions

Publication Details

Journal
IEEE Sensors Journal
Published
2024-10-28
DOI
https://doi.org/10.1109/jsen.2024.3477733
Citations
2
Primary Topic
Nanofabrication and Lithography Techniques
Type
article
Field-Weighted Citation Impact
0.37

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Preparation of Flexible Polymer Sensor Material by Spatial Confining Forced Network Assembly Micro Injection Molding

Yao Huang, Jingyao Sun, Phil Coates, Shuangquan Zhou et al.
2 citations
IEEE Sensors Journal
Nanofabrication and Lithography Techniques
0.37
article

Preparation of Flexible Polymer Sensor Material by Spatial Confining Forced Network Assembly Micro Injection Molding

Yao Huang, Jingyao Sun, Phil Coates, Shuangquan Zhou, Xiaolong Gao, Xiaojie Wang, Junyi Wang, Daming Wu, Hong Xu, Ben Whiteside
article en
2 citations

Abstract

The development of high-performance flexible pressure-sensing materials necessitates the simultaneous achievement of exceptional flexibility, conductivity, and alignment of microstructure–nanostructure with the mechanical response characteristics inherent to these materials. In this study, we propose a novel method for preparing flexible microneedles as a pressure-sensitive sensor array. First, we obtain conductive composite particles through extrusion granulation, which consists of a compact conductive network with micron-scale filler as the skeleton and nanofiller filling in the gaps within the network. Moreover, by utilizing the “volume exclusion” effect of the microneedle array on the micron-scale filler during injection molding, nanofillers dominate in entering the microneedle. As a result, our molded product exhibits high flexibility and moderate conductivity in its pressure-sensitive area, thereby providing ultrahigh-pressure resistance along with desired response characteristics and sensitivity for sensors. In addition, due to synergistic effects between microscale fillers and nanofillers in nonpressure sensitive bases, a compact conductive network is formed that imparts sufficient conductivity to sensor materials. The method yields sensors with excellent repeatability, high dimensional accuracy, and good consistency, effectively addressing the core application challenges of flexible sensors. The microstructure array flexible sensor fabricated using high-precision injection molding technology offers high efficiency, low cost, and scalability for mass production. Furthermore, the sensitivity of sensors produced by this method is significantly higher—26.6% greater than those made using traditional methods—with a sensitivity as high as 4.71 kPa<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{-{1}}$ </tex-math></inline-formula>.

IEEE Sensors JournalVol. 24(24)
University of Bradford (GB), Beijing University of Chemical Technology (CN)
Engineering and Physical Sciences Research Council
Affordable and clean energy
Openalex Percentile: Top 43%
Nanofabrication and Lithography Techniques
0.37
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.